Semiconductor integrated circuit device and method of manufacturing the same

ABSTRACT

The film quality of a metal film formed by CVD is enhanced, such as a Ru film configuring a lower electrode of an information storage capacitor. A WN film serving as an adhesive layer is deposited by sputtering over the sidewalls and bottom surface of a hole in a silicon oxide film where the information storage capacitor is formed. A Ru film to be a lower electrode for the information storage capacitor is formed above the WN film by CVD using Ru(HFAC) 3 , H 2 O and H 2  as ingredients so that a ratio of partial pressure of H 2 O to H 2  among the ingredients is controlled to be in the area below a graph (a). In this manner, when the Ru film is formed by CVD utilizing hydrolysis, the film quality of the Ru film can be enhanced. Additionally, the ratio of partial pressure of H 2 O to H 2  is controlled, whereby the oxidation of the Ru film can be suppressed. Furthermore, when it is controlled to be in the area below a graph (b) to form the Ru film, the oxidation of the WN film can be suppressed.

BACKGROUND OF THE INVENTION

[0001] The present invention relates to a semiconductor integrated circuit device and a method of manufacturing the same, particularly to an effective technique adapted to a method of depositing metal films or metal oxides according to Chemical Vapor Deposition (CVD).

PRIOR ART

[0002] Semiconductor devices or interconnect lines configuring a semiconductor integrated circuit device are formed by repeating the formation of conductive films or insulating films and the photolithography and patterning of each film. One of methods for forming these films is CVD that uses chemical reactions.

[0003] In the meantime, for example, a DRAM (Dynamic Random Access Memory) has memory cell selecting MISFETs and information storage capacitor directly connected to the memory syucell selecting MISFETs. The information storage capacitor is formed by sequentially depositing a conductive layer to be a lower electrode, a capacitor dielectric, and a conductive layer to be an upper electrode. It is studied to use a metal film such as Ru (ruthenium) for the lower electrode.

[0004] Such metal film or capacitor dielectric can also be formed by CVD. For instance, Japanese Patent Laid-Open No. 246214/1997 discloses a method for forming a Ru film by CVD using Ru(DMHPD)₃: 2,6-dimethyl 3,5-heptadione Ruthenium, as a ingredient.

[0005] Additionally, Japanese Patent Laid-Open No. 86270/1995 describes a technique of forming SrTiO₃ to be a capacitor dielectric by CVD using organic metal as a ingredient.

SUMMARY OF THE INVENTION

[0006] The inventor has been doing the research and development of the DRAM and has been studying a variety of configurations or forming methods of the information storage capacitor.

[0007] With the miniaturization of the semiconductor integrated circuit device, an area for forming the information storage capacitor also tends to be reduced, and it has become difficult to secure a desired capacity. Then, studies on materials for electrodes or capacitor dielectric are needed in order to obtain a high capacity with a small area.

[0008] Then, the inventor adopts a Ru film for the lower electrode of the information storage capacitor and has been doing various studies on the forming methods. Platinum metals such as Ru do not generate a low dielectric constant film like an oxynitride film even in annealing after it is formed. Additionally, it can be formed thinly because of metal and it is considered preferably to increase capacity.

[0009] To form the Ru film, for example, a forming method by CVD is considered, which uses a tetrahydrofuran solution of ethoxycyclopentadienylruthenium (Ru(C₂H₅OC₅H₄)₂) and O₂ (oxygen) as ingredients.

[0010] However, the deposition utilizing such reaction of the organic compound (ethoxycyclopentadienylruthenium) and oxygen leaves organic compounds or compounds of these and oxygen in the Ru film to degrade the film quality of the Ru film.

[0011] Furthermore, a problem arises that a metal layer formed under the Ru film is oxidized when high temperature annealing is performed after forming the Ru film in order to remove the organic compounds in the Ru film. For example, the platinum metals such as Ru generally have poor adhesion to insulating films like silicon oxide. Thus, a metal layer to serve as an adhesive layer is formed between these films to prevent peeling. However, this metal layer reacts with oxygen in the Ru film to be oxidized in the annealing described above. Consequently, a problem arises that conducting failure is generated between the information storage capacitor (lower electrode) and the memory cell selecting MISFETs.

[0012] The purpose of the invention is to provide a technique for enhancing the film quality of a metal film formed by CVD, such as the Ru film configuring the lower electrode of the information storage capacitor.

[0013] Another purpose of the invention is to form an excellent metal film to improve the characteristics of a semiconductor integrated circuit device having the same.

[0014] The aforesaid and other purposes and the novel features of the invention will be apparent from the description of the specification and accompanying drawings.

MEANS FOR SOLVING THE INVENTION

[0015] Among the inventions disclosed in the application, representative ones are as follows:

[0016] 1. A method of manufacturing a semiconductor integrated circuit device of the invention has the step of forming a metal film over a semiconductor substrate, such as a Ru film configuring a lower electrode of a capacitor by CVD using a compound of metal forming the metal film, H₂O and a reducing agent such as H₂.

[0017] 2. A method of manufacturing a semiconductor integrated circuit device of the invention has the step of forming a metal film over a semiconductor substrate, such as a Ru film configuring a lower electrode of a capacitor or Cu film configuring interconnect lines by CVD using a compound of metal forming the metal film, H₂O and a reducing agent such as H₂ at a predetermined temperature. Additionally, when using H₂, the method has the step of forming the metal film under a condition that a ratio of partial pressure of the H₂O to the H₂ [H₂O]/[H₂]) becomes smaller than a ratio of H₂O to H₂ ([H₂O]eq/[H₂]eq) when a system 1 (an oxide of metal forming the metal film+H₂) and a system 2 (a metal forming the metal film+H₂O) are in equilibrium at the temperature.

[0018] 3. A method of manufacturing a semiconductor integrated circuit device of the invention has the step of forming a metal oxide film over a semiconductor substrate, such as a tantalum oxide film to be a capacitor dielectric of a capacitor by CVD using a compound of metal forming the metal oxide film, H₂O and a reducing agent such as H₂ at a predetermined temperature. Furthermore, when using H₂, the method has the step of forming the metal oxide film under a condition that a ratio of partial pressure of the H₂O to the H₂ ([H₂O]/[H₂]) becomes greater than a ratio of H₂O to H₂ ([H₂O]eq/[H₂]eq) when a system 1 (an oxide of metal forming the metal oxide film+H₂) and a system 2 (a metal forming the metal oxide film+H₂O) are in equilibrium at the temperature.

[0019] 4. A method of manufacturing a semiconductor integrated circuit device of the invention is a method of manufacturing a semiconductor integrated circuit device having a second metal film (Ru film or Cu film) over a first metal film or first metal nitride film overlaying a semiconductor substrate, such as a W film or WN film to serve as an adhesive layer or barrier layer, and the method has the step of forming the second metal film by CVD using a compound of metal forming the second metal film, H₂O and a reducing agent such as H₂ at a predetermined temperature. Moreover, when using H₂, it has the step of forming the second metal film under a condition that a ratio of partial pressure of the H₂O to the H₂ ([H₂O]/[H₂]) becomes smaller than a ratio of H₂O to H₂ ([H₂O]eq/[H₂]eq) when a system 1 (an oxide of metal forming the first metal film or first metal nitride film+H₂) and a system 2 (a metal forming the first metal film or first metal nitride film+H₂O) are in equilibrium at the temperature.

[0020] 5. A method of manufacturing a semiconductor integrated circuit device of the invention is a method of manufacturing a semiconductor integrated circuit device having a second metal oxide film (a tantalum oxide film to be a capacitor dielectric) over a first metal film or first metal nitride film overlaying a semiconductor substrate, such as a W film or WN film serving as a barrier layer or a Ru film configuring a lower electrode for the capacitor, the method has the step of forming the second oxide film by CVD using a compound of metal forming the second metal oxide film, H₂O and H₂ at a predetermined temperature. Additionally, when using H₂, the second metal oxide film is formed under a condition that a ratio of partial pressure of the H₂O to the H₂ ([H₂O]/[H₂]) becomes greater than a ratio of partial pressure of H₂O to H₂ ([H₂O]eq1/[H₂]eq1) when a system 1 (an oxide of metal forming the second metal oxide film+H₂) and a system 2 (a metal forming the second metal oxide film+H₂O) are in equilibrium at the temperature and becomes smaller than a ratio of partial pressure of H₂O to H₂ ([H₂O]eq2/[H₂]eq2) when a system 3 (an oxide of metal forming the first metal film or first metal nitride film+H₂) and a system 4 (a metal forming the first metal film or first metal nitride film+H₂O) are in equilibrium at the temperature.

BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The teachings of the invention can be readily understood by considering the following detailed description in conjunction with the accompanying drawings, in which:

[0022]FIG. 1 is a feature section of a semiconductor substrate illustrating a method of manufacturing a semiconductor integrated circuit device as an embodiment 1 of the invention;

[0023]FIG. 2 is a feature plan view of the semiconductor substrate illustrating the method of manufacturing the semiconductor integrated circuit device as the embodiment 1 of the invention;

[0024]FIG. 3 is a feature section of the semiconductor substrate illustrating the method of manufacturing the semiconductor integrated circuit device as the embodiment 1 of the invention;

[0025]FIG. 4 is a feature section of the semiconductor substrate illustrating the method of manufacturing the semiconductor integrated circuit device as the embodiment 1 of the invention;

[0026]FIG. 5 is a feature section of the semiconductor substrate illustrating the method of manufacturing the semiconductor integrated circuit device as the embodiment 1 of the invention;

[0027]FIG. 6 is a feature section of the semiconductor substrate illustrating the method of manufacturing the semiconductor integrated circuit device as the embodiment 1 of the invention;

[0028]FIG. 7 is a feature section of the semiconductor substrate illustrating the method of manufacturing the semiconductor integrated circuit device as the embodiment 1 of the invention;

[0029]FIG. 8 is a feature section of the semiconductor substrate illustrating the method of manufacturing the semiconductor integrated circuit device as the embodiment 1 of the invention;

[0030]FIG. 9 is a feature section of the semiconductor substrate illustrating the method of manufacturing the semiconductor integrated circuit device as the embodiment 1 of the invention;

[0031]FIG. 10 is a feature section of the semiconductor substrate illustrating the method of manufacturing the semiconductor integrated circuit device as the embodiment 1 of the invention;

[0032]FIG. 11 is a feature section of the semiconductor substrate illustrating the method of manufacturing the semiconductor integrated circuit device as the embodiment 1 of the invention;

[0033]FIG. 12 is a feature section of the semiconductor substrate illustrating the method of manufacturing the semiconductor integrated circuit device as the embodiment 1 of the invention;

[0034]FIG. 13 is a diagram illustrating a ratio of partial pressure of H₂O to H₂ while forming the Ru film;

[0035]FIG. 14 is a diagram illustrating a reaction mechanism of depositing the Ru film;

[0036]FIG. 15 is a feature section of the semiconductor substrate illustrating the method of manufacturing the semiconductor integrated circuit device as the embodiment 1 of the invention;

[0037]FIG. 16 is a feature section of the semiconductor substrate illustrating the method of manufacturing the semiconductor integrated circuit device as the embodiment 1 of the invention;

[0038]FIG. 17 is a feature plan view of the semiconductor substrate illustrating the method of manufacturing the semiconductor integrated circuit device as the embodiment 1 of the invention;

[0039]FIG. 18 is a feature section of a semiconductor substrate illustrating a method of manufacturing the semiconductor integrated circuit device as an embodiment 2 of the invention;

[0040]FIG. 19 is a diagram illustrating a ratio of partial pressure of H₂O to H₂ while forming the Ru film;

[0041]FIG. 20 is a diagram illustrating a ratio of partial pressure of H₂O to H₂ while forming the Ru film;

[0042]FIG. 21 is a diagram illustrating a ratio of partial pressure of H₂O to H₂ while forming the Ru film;

[0043]FIG. 22 is a feature section of a semiconductor substrate illustrating a method of manufacturing the semiconductor integrated circuit device as an embodiment 3 of the invention;

[0044]FIG. 23 is a diagram illustrating a ratio of partial pressure of H₂O to H₂ while forming the tantalum oxide film;

[0045]FIG. 24 is a diagram illustrating a ratio of partial pressure of H₂O to H₂ while forming the tantalum oxide film;

[0046]FIG. 25 is a feature section of a semiconductor substrate illustrating a method of manufacturing the semiconductor integrated circuit device as an embodiment 4 of the invention;

[0047]FIG. 26 is a feature section of the semiconductor substrate illustrating the method of manufacturing the semiconductor integrated circuit device as the embodiment 4 of the invention;

[0048]FIG. 27 is a feature section of the semiconductor substrate illustrating the method of manufacturing the semiconductor integrated circuit device as the embodiment 4 of the invention;

[0049]FIG. 28 is a feature section of the semiconductor substrate illustrating the method of manufacturing the semiconductor integrated circuit device as the embodiment 4 of the invention;

[0050]FIG. 29 is a diagram illustrating a ratio of partial pressure of H₂O to H₂ while forming the Cu film;

[0051]FIG. 30 is a diagram illustrating a ratio of partial pressure of H₂O to H₂ while forming the Cu film;

[0052]FIG. 31 is a diagram illustrating a depositing reaction of the Cu film;

[0053]FIG. 32 is a feature section of the semiconductor substrate illustrating the method of manufacturing the semiconductor integrated circuit device as the embodiment 4 of the invention;

[0054]FIG. 33 is a feature section of the semiconductor substrate illustrating the method of manufacturing the semiconductor integrated circuit device as the embodiment 4 of the invention;

[0055]FIG. 34 is a feature section of the semiconductor substrate illustrating the method of manufacturing the semiconductor integrated circuit device as the embodiment 4 of the invention;

[0056]FIG. 35 is a feature section of the semiconductor substrate illustrating the method of manufacturing the semiconductor integrated circuit device as the embodiment 4 of the invention;

[0057]FIG. 36 is a diagram illustrating a depositing reaction of the Ru film; and

[0058]FIG. 37 is a diagram illustrating a depositing reaction of the Ru film.

DETAILED DESCRIPTION OF THE INVENTION

[0059] Hereafter, embodiments of the invention will be described in accordance with the drawings in detail. Additionally, in all the drawings for illustrating the embodiments, members having the same functions are designated the same numerals and signs, omitting the overlapping description.

[0060] Embodiment 1

[0061] A method for manufacturing a DRAM of this embodiment will be described in order of steps with FIGS. 1 to 17.

[0062] First, as shown in FIG. 1, a device isolation 2 is formed across the device isolation area on the front surface of a semiconductor substrate 1 comprised of p-type monocrystal silicon, for example. In addition, the device isolation 2 is formed, whereby narrow, island-shaped active regions (L) surrounded by the device isolation 2 are formed simultaneously, as shown in FIG. 2. Each of the active regions (L) is formed with two memory cell selecting MISFETs Qs sharing either source or drain.

[0063] To form the device isolation 2, the surface of the semiconductor substrate 1 is etched to form a trench having a depth of about 300 to 400 nm, and a thin silicon oxide film is formed inside the trench. Subsequently, a silicon oxide film 4 (a film thickness of about 600 nm) is deposited above the semiconductor substrate 1 including the inside of the trench, and then the silicon oxide film 4 is polished back by CMP (Chemical Mechanical Polishing).

[0064] After that, B (boron) is ion-implanted into the semiconductor substrate 1 to form a p-well 3, the surface of the p-well 3 is rinsed with HF (hydrofluoric acid) based cleaning liquid, and then the semiconductor substrate 1 is thermally oxidized, whereby the surface of the p-well 3 (active region L) is formed with a gate dielectric 5 having a film thickness of about 6 nm.

[0065] Subsequently, as shown in FIG. 3, a gate electrode 6 is formed above the gate dielectric 5. The gate electrode 6 is formed in which a n-type polycrystalline silicon film (a film thickness of about 70 nm) doped with P (phosphorus), a barrier metal film (a film thickens of about 5 to 10 nm) comprised of WN (tungsten nitride) or TiN (titanium nitride), a W film (tungsten film having a film thickness of about 100 nm) and a silicon nitride film 7 (a film thickness of about 150 nm) are sequentially deposited above the gate dielectric 5, for example, and then a photoresist film (not shown) is used as a mask to dry-etch these films. The polycrystalline silicon film and the silicon nitride film 7 are deposited by CVD, and the barrier metal film and the W film are deposited by sputtering. The gate electrode 6 functions as a word line (WL). Then, wet hydrogen oxidation is performed and a thin silicon oxide film is formed on the sidewalls of the n-type polycrystalline silicon film configuring the gate electrode 6. This wet hydrogen oxidation can selectively form an oxide film only on silicon.

[0066] After that, as shown in FIG. 4, As (arsenic) or P (phosphorous) is ion-implanted into the p-well 3 to form n-type semiconductor regions 8 (source/drain) on both sides of the gate electrode 6. By the steps so far, the memory cell selecting MISFETs Qs are almost completed.

[0067] Next, a silicon nitride film 9 (a film thickness of 50 nm) and a silicon oxide film 10 (a film thickness of about 600 nm) are deposited above the semiconductor substrate 1 by CVD, the surface of the silicon oxide film 10 is planarized by CMP, and then a photoresist film (not shown) is used as a mask to dry-etch the silicon oxide film 10 and the silicon nitride film 9, whereby contact holes 11 and 12 are formed above the n-type semiconductor regions 8 (source/drain) of the memory cell selecting MISFETs Qs. The silicon oxide film 10 is etched under a condition of a greater selection ratio to the silicon nitride film, and the silicon nitride film 9 is etched under a condition of a greater selection ratio to silicon or the silicon oxide film. Accordingly, the contact holes 11 and 12 are formed in self-alignment to the gate electrodes 6 (word lines).

[0068] Subsequently, as show in FIG. 5, a plug 13 is formed inside the contact holes 11 and 12. To form the plug 13, an n-type polycrystalline silicon film doped with P is deposited above the silicon oxide film 10 by CVD to bury the n-type polycrystalline silicon film inside the contact holes 11 and 12, and then the n-type polycrystalline silicon film outside the contact holes 11 and 12 is removed by CMP (or etch back).

[0069] After that, a silicon oxide film 14 (a film thickness of about 150 nm) is deposited above the silicon oxide film 10 by CVD, and then a photoresist film (not shown) is used as a mask to dry-etch the silicon oxide film 14 above the contact hole 11, whereby a through hole 15 is formed.

[0070] Subsequently, a plug 16 is formed inside the through hole 15. To form the plug 16, a barrier metal film comprised of a laminated film of a Ti film and a TiN film is deposited above the silicon oxide film 14 by sputtering, for example, a W film is deposited above the barrier metal film by CVD to bury these films inside the through hole 15, and then these films outside the through hole 15 are removed by CMP. Through these plugs 16 and 13, n-type semiconductor regions 8 (source/drain) of the memory cell selecting MISFETs Qs are connected to a bit line BL described later.

[0071] After that, the bit line BL is formed on the silicon oxide film 14 and the plug 16. To form the bit line BL, for example, a TiN film (a film thickness of about 10 nm, not shown) is deposited above the silicon oxide film 14 by sputtering, a W film (a film thickness of about 50 nm) is deposited above the TiN film by CVD, and then a photoresist film (not shown) is used as a mask to dry-etch these films.

[0072] Then, as shown in FIG. 6, a silicon oxide film 17 (a film thickness of about 300 nm) is deposited above the bit line BL by CVD, and then the surface is planarized by CMP. Subsequently, a silicon nitride film 18 (a film thickness of about 50 nm) is deposited above the silicon oxide film 17 by CVD.

[0073] After that, the silicon nitride film 18 and the silicon oxide film 17 are dry-etched, whereby a through hole 19 is formed above the contact hole 12 buried with the plug 13.

[0074] The through hole 19 is formed so as to have the diameter smaller than that of the contact hole 12 thereunder. In this case, the diameter is about 0.1 μm. More specifically, a polycrystalline silicon film 20 is deposited above the silicon nitride film 18 by CVD, the polycrystalline silicon film 20 where the through hole 19 is formed is dry-etched to form a hole (the diameter is about 0.18 μm), and then a polycrystalline silicon film (not shown) is further deposited above the polycrystalline silicon film 20. Subsequently, the polycrystalline silicon film above the polycrystalline silicon film 20 is anisotropically etched to form a sidewall spacer 21 on the sidewalls of the hole, and then the polycrystalline silicon film 20 and the sidewall spacer 21 are used as a hard mask to dry-etch the silicon nitride film 18 and the silicon oxide films 17 and 14 on the bottom surface of the hole.

[0075] After that, the polycrystalline silicon film 20 and the sidewall spacer 21 are removed by dry etching, and then a plug 22 is formed inside the through hole 19 as shown in FIG. 7. To form the plug 22, an n-type polycrystalline silicon film doped with P is first deposited above the silicon nitride film 18 by CVD to bury the n-type polycrystalline silicon film inside the through hole 19, and then the n-type polycrystalline silicon film outside the through hole 19 is removed by CMP (or etch back). At this time, the polycrystalline silicon film is over polished (or over etched), whereby the height of the surface of the plug 22 is recessed below the top end part of the through hole 19.

[0076] Then, as shown in FIG. 8, a barrier layer 23 is formed above the plug 22. To form the barrier layer 23, a WN film is deposited above the silicon nitride film 18 by sputtering, and then the WN film outside the through hole 19 is removed by CMP (or dry etching). The barrier layer 23 is formed in order to prevent an undesirable silicide reaction from occurring, in which Ru (ruthenium) configuring an under electrode 30A reacts with polycrystalline silicon configuring the plug 22 to form suicides due to annealing performed in the course of manufacturing processes described later. Additionally, the barrier layer 23 may be formed of a W film or TaN film (tantalum nitride).

[0077] After that, an information storage capacitor C is formed, which is comprised of the lower electrode 30A formed of Ru film 30, a capacitor dielectric formed of a tantalum oxide film 32, and an upper electrode 33 formed of a W film and a Ru film.

[0078] The forming steps of the information storage capacitor C will be described in detail with reference to FIGS. 9 to 17. These drawings schematically depict an area where the information storage capacitor C is to be formed above the plug 22.

[0079] As shown in FIG. 9, a silicon oxide film 24 is deposited over the barrier layer 23 and the silicon nitride film 18. The lower electrode of the information storage capacitor C is formed inside a hole (recessed part) that is formed in the silicon oxide film 24. In order to increase the surface area of the lower electrode to raise the amount of charge stored, the silicon oxide film 24 needs to be deposited thick (about 0.8 μm). The silicon oxide film 24 is deposited by plasma CVD using oxygen and tetraethoxysilane (TEOS) as source gases, for example, and then the surface thereof is planarized by CMP as necessary.

[0080] Subsequently, a W film having a film thickness of about 200 nm is deposited above the silicon oxide film 24 by sputtering, and then an anti-reflection coating is applied over the W film, whereby a hard mask 26 is formed. The hard mask 26 (W film) has a greater etching selection ratio to the silicon oxide film 24 as compared with a photoresist film, thus it is used as a mask in etching the silicon oxide film 24 having a thick film thickness.

[0081] Then, as shown in FIG. 10, a photoresist film (not shown) is formed over the hard mask 26, and the photoresist film is used as a mask to dry-etch the hard mask 26. Subsequently, the hard mask 26 is used as a mask to dry-etch the silicon oxide film 24, whereby a deep hole (recessed part) 27 is formed. In the bottom surface of the deep hole (recessed part) 27, the surface of the barrier layer 23 inside the through hole 19 is exposed.

[0082] After that, the hard mask 26 remained above the silicon oxide film 24 is removed with a solution containing hydrogen peroxide solution, and then a WN film 29 (a film thickness of about 15 nm) is deposited above the silicon oxide film 24 and inside the hole 27 by sputtering, as shown in FIG. 11. This WN film 29 has an excellent adhesion to the silicon oxide film 24 to be an underlayer or to the Ru film 30 described later, and thus it is used as an adhesive layer. Furthermore, this WN film 29 becomes a seed for crystal growth in forming the Ru film 30 described later, and it allows the Ru film 30 to have an excellent deposition property.

[0083] Then, as shown in FIG. 12, the Ru film 30 (a film thickness of about 30 nm) is to be deposited above the WN film 29 by CVD. However, a Ru film having a film thickness of about 15 nm (not shown) is formed by sputtering before depositing the Ru film by CVD. This is because the film formed by sputtering becomes a seed to efficiently grow the Ru film 30 by CVD.

[0084] The Ru film 30 is formed by using Ru(HFAC)₃ that is an acetylacetone derivative compound of Ru, H₂O (water vapor) and H₂ (hydrogen) as ingredients. Additionally, HFAC means (CF₃COCHCOCF₃). A compound bonded with a C(CH₃)₃ group may be used instead of this CF₃ group. Furthermore, Ru(HFAC) (1,5-cyclooctadiene) may be used.

[0085] This organic compound solution of Ru(HFAC)₃ is vaporized to react with H₂O and H₂ for deposition. Moreover, as organic compound solution, a tetrahydrofuran solution and the like is named. Here, a reaction is generated as a ratio of partial pressure of H₂O to H₂ is controlled to be in the area below a graph (a) shown in FIG. 13.

[0086] First, the reaction mechanism of depositing the Ru film will be described. As for this reaction mechanism, a mechanism shown in FIG. 14 can be considered. As shown in FIG. 14, Ru(HFAC)₃ first reacts with H₂O (it is decomposed by H₂O) to become a Ru(OH)₃ hydroxide (FIG. 14(a)). Then, this Ru(OH)₃ hydroxide is reduced by hydrogen to generate Ru (FIG. 14(b)). As apparent from this reaction mechanism, H₂O is not consumed and functions like a catalyst. In addition, a reaction chamber where the reaction is performed is evacuated, and thus H₂O also needs to be fed properly, as similar to Ru(HFAC)₃ or H₂ that is a substantial ingredient.

[0087] In this manner, according to the embodiment, Ru(HFAC)₃, H₂O and H₂ were used to form the Ru film in hydrolysis, and thus a Ru film having an excellent film quality can be formed.

[0088] For example, an organic compound solution of Ru such as a tetrahydrofuran solution of ethoxycyclopentadienylruthenium (Ru(C₂H₅OC₅H₄)₂) is vaporized to react with O₂, whereby a Ru film can also be deposited. However, in this case, it is a reaction where incomplete combustion is generated to create Ru so as not to oxidize Ru. Consequently, in addition to carbon, hydrogen or oxygen compounds of these, organic compounds or oxides of these that are generated in reaction are taken into the Ru film to cause the film quality of the Ru film to be degraded. Furthermore, the annealing performed after this, such as annealing for densifying the Ru film causes carbon, hydrogen or oxygen compounds of these taken into the Ru film to be vaporized to degrade the film quality of the Ru film. Moreover, oxygen or oxygen compounds in the Ru film oxidize the WN film 29 that is to be an adhesive layer or barrier layer 23 to cause conducting failure between the plug 22 and the lower electrode (Ru film 30). Particularly, as described above, the conducting failure tends to occur when the diameter of the plug 22 is small.

[0089] Contrary to this, according to the embodiment, the hydrolysis of Ru(HFAC)₃ is utilized to generate the Ru film, and thus by-products taken into the Ru film, such as carbon, hydrogen or compounds of these can be reduced. More specifically, the Ru film having an excellent crystalline property can be formed. Therefore, even though annealing performed after this, such as annealing for densifying the Ru film causes carbon, hydrogen or oxygen compounds of these taken into the Ru film to be vaporized, the film quality of the Ru film can be maintained with a small amount of vaporization. Additionally, also in annealing a capacitor dielectric to be formed above the lower electrode (Ru film 30) described later, the film shrinkage due to the vaporization of carbon in the Ru film can be made smaller, and the capacitor dielectric can be prevented from being damaged. Consequently, the characteristics of the information storage capacitor C can be enhanced. Furthermore, the amount of oxygen or oxygen compounds in the Ru film can be reduced, and the conducting failure between the plug 22 and the lower electrode (Ru film 30) can be avoided.

[0090] Moreover, the reason why the ratio of partial pressure of H₂O to H₂ is controlled so as to be in the area below the graph (a) shown in FIG. 13 is to suppress the oxidation of Ru in depositing the Ru film. That is, in depositing the Ru film, the reaction between H₂O and Ru generated can cause a side reaction of generating RuO₂ (ruthenium oxide). Hereafter, the reason why this reaction (Ru oxidation) can be suppressed will be described.

[0091] The graph (a) shown in FIG. 13 depicts logarithms of equilibrium constant k in terms of reaction temperatures in which a system 1 (RuO₂ H₂) and a system 2 (Ru+H₂O) are in equilibrium. It is expressed by logk log[[H₂O]eq/[H₂]eq], where [H₂O]eq is a partial pressure of H₂O in equilibrium, and [H₂]eq is a partial pressure of H₂ in equilibrium. Additionally, this equilibrium constant k is determined by the difference (ΔG) of the Gibbs free energy between the system 1 and the system 2, where ΔG is RTlnk.

[0092] Accordingly, under a condition of being in the area above the graph (a), a balance is moved into oxidizing Ru. However, when the Ru film is deposited as the ratio of partial pressure of H₂O to H₂ is controlled to be in the area below the graph (a) shown in FIG. 13, the oxidation of Ru can be suppressed.

[0093] At the same time, the deposition of the Ru film needs to vaposrize a solution of Ru(HFAC)₃ which is the ingredient, and also the decomposition of the ingredient can occur when processed at high temperatures. Thus, it is considered that the reaction temperatures are preferably from 100 to 200° C. (a boiling point of the ingredient or above) to about 500° C.

[0094] Therefore, according to the embodiment, the reaction was generated in which Ru(HFAC)₃, H₂O and H₂ are used and further the ratio of partial pressure of H₂O to H₂ is controlled so as to be in the area below the graph (a) shown in FIG. 13. Thus, the oxidation of the Ru film is prevented and an excellent Ru film having a smaller content of oxygen, carbon or compounds of these can be formed.

[0095] Then, annealing is performed for one minute at a temperature of 700° C. to densify the Ru film 30. Additionally, the crystalline property of the Ru film is excellent as described above. Therefore, less carbon is vaporized from the Ru film due to this annealing, and the film quality of the Ru film can be maintained.

[0096] Subsequently, as shown in FIG. 15, a photoresist film (not shown) is applied over the Ru film 30 to undergo exposure throughout the surface for development, whereby the photoresist film (not shown) is left inside the hole 27. This photoresist film is used as a protection film for preventing the Ru film 30 inside the hole 27 (sidewalls and bottom surface) from being eliminated in removing the unnecessary Ru film 30 above the silicon oxide film 24 in the subsequent step. Then, the photoresist film is used as a mask for dry etching to remove the Ru film 30 above the silicon oxide film 24, whereby the lower electrode 30A is formed. After that, the photoresist film inside the hole 27 is removed.

[0097] Then, the tantalum oxide film 32 having a film thickness of about 10 nm to be a capacitor dielectric is deposited inside the hole 27 and above the silicon oxide film 24 where the lower electrode 30A has been formed. The tantalum oxide film 32 is deposited by CVD using pentaethoxytantalum (Ta(OC₂H₅)₅) and oxygen as ingredients. After that, it undergoes annealing in an Ar (argon) atmosphere at a temperature of 650° C. to crystallize tantalum oxide. Furthermore, the Ru film has an excellent crystalline property as described above. Thus, the film shrinkage of the Ru film in this annealing can be reduced, and the tantalum oxide film 32 can be prevented from being damaged.

[0098] Subsequently, as shown in FIG. 16, the upper electrode 33 is formed above the tantalum oxide film 32. The upper electrode 33 is formed by depositing a Ru film 33 a (a film thickness of about 70 nm) and a W film 33 b (a film thickness of about 100 nm) above the tantalum oxide film 32 by CVD, for example. The Ru film 33 a may be formed as similar to the Ru film 30. The W film 33 b is used for reducing the contact resistance between the upper electrode 33 and interconnect lines in the upper layer. Moreover, a TiN film may be formed between the Ru film 33 a and the W film 33 b to prevent an increase in resistance due to the gas diffusion from the capacitor dielectric (tantalum oxide film 32) to the W film.

[0099] By the steps up to now, the information storage capacitor C is completed, which is comprised of the lower electrode 30A formed of the Ru film 30, the capacitor dielectric film formed of the tantalum oxide film 32, and the upper electrode 33 formed of the W film 33 b and the Ru film 33 a. Memory cells of a DRAM are almost completed, which are configured of the memory cell selecting MISFETs Qs and the information storage capacitor C connected thereto in series. FIG. 17 depicts a plan view of the semiconductor substrate where the information storage capacitor C have been formed. FIG. 7 corresponds to a section of a line A-A in FIG. 17, for example.

[0100] After that, an interlayer dielectric 34 comprised of a silicon oxide film is formed above the information storage capacitor C, about two layers of Al interconnects are further formed above the interlayer dielectric, and a passivation film is formed above the uppermost layer of the Al interconnect, but these drawings are omitted.

[0101] As described above in detail, according to the embodiment, the hydrolysis of Ru(HFAC)₃ was utilized to generate the Ru film. Thus, by-products taken into the Ru film can be reduced, and the film quality of the Ru film can be enhanced.

[0102] Additionally, in the embodiment, the ratio of partial pressure of H₂O to H₂ used in depositing the Ru film was controlled so as to be in the area below the graph (a) shown in FIG. 13, and therefore the oxidation of the Ru film can be suppressed while depositing the Ru film.

[0103] Consequently, the characteristics of the information storage capacitor C can be enhanced, and the characteristics of the memory cells can be improved. Furthermore, a desired capacity can be secured even in the scaled-down memory cell structure.

[0104] Embodiment 2

[0105] In the embodiment 1, the Ru film 30 was formed in which Ru(HFAC)₃, H₂O and H₂ are used as ingredients and the ratio of partial pressure of H₂O to H₂ is controlled so as to be in the area below the graph (a) shown in FIG. 13. However, the Ru film may be formed under a condition of the ratio of partial pressure of H₂O to H₂ described below.

[0106] Hereafter, a method for manufacturing a DRAM in this embodiment will be described. Additionally, the steps of forming the WN film 29 serving as an adhesive layer, the description will be omitted because it is the same as the case of the embodiment 1 that has been described with reference to FIGS. 1 to 11.

[0107] As shown in FIG. 18, a Ru film having a film thickness of about 15 nm (not shown) is formed above the WN film 29 by sputtering, and then a Ru film 230 having a film thickness of about 30 nm is deposited by CVD.

[0108] Here, this Ru film 230 is to be formed by using Ru(HFAC)₃, H₂O and H₂ as ingredients, similar to the embodiment 1. However, at this time, the reaction is generated as the ratio of partial pressure of H₂O to H₂ is controlled so as to be in the area below a graph (b) shown in FIG. 19.

[0109] A graph (a) shown in FIG. 19 depicts logarithms of equilibrium constant k in terms of reaction temperatures, in which a system 1 (RuO₂+H₂) and a system 2 (Ru+H₂O) are in equilibrium, whereas the graph (b) depicts logarithms of equilibrium constant k in terms of reaction temperatures, in which a system 1 (WO₂+H₂) and a system 2 (W+H₂O) are in equilibrium. As described in the embodiment 1, it is expressed by logk log[[H₂O]eq/[H₂]eq], where [H₂O]eq is a partial pressure of H₂O in equilibrium, [H₂]eq is a partial pressure of H₂ in equilibrium, and this equilibrium constant k is determined by the difference (ΔG) of the Gibbs free energy between the system 1 and the system 2.

[0110] Accordingly, under a condition of being in the area above the graph (b), a balance is moved into oxidizing W. However, when the Ru film is deposited as the ratio of partial pressure of H₂O to H₂ is controlled so as to be in the area below the graph (b) shown in FIG. 19, the oxidation of Ru is suppressed and the oxidation of W can also be suppressed.

[0111] Consequently, in addition to the effect described in the embodiment 1, the oxidation of W in the WN film 29 serving as an adhesive layer or barrier film 23 can be suppressed. Therefore, the conducting failure between the Ru film 230 (lower electrode) and the plug 22 can be prevented. Additionally, the oxidation of W can also be suppressed in the case where the WN film 29 or barrier film 23 is formed of a W film. Furthermore, in the case where the WN film 29 or barrier film 23 is formed of a TaN film, when the reaction is generated as the ratio of partial pressure of H₂O to H₂ is controlled so as to be in the area below a graph (c) shown in FIG. 20 in forming the Ru film, the oxidation of Ta in the TaN film can be suppressed. The graph (c) shown in FIG. 20 depicts logarithms of equilibrium constant k in terms of reaction temperatures, in which a system 1 (Ta₂O₅+H₂) and a system 2 (Ta+H₂O) are in equilibrium.

[0112] Then, annealing is performed for one minute at a temperature of 700° C. to densify the Ru film 230.

[0113] The steps after this are the same as the case of the embodiment 1 that has been described with reference to FIGS. 15 and 16, and thus the description will be omitted.

[0114] As described above in detail, according to the embodiment, the Ru film 230 was formed in which Ru(HFAC)₃, H₂O and H₂ are used as ingredients and the ratio of partial pressure of H₂O to H₂ is controlled so as to be in the area below the graph (b) shown in FIG. 19. Thus, the oxidation of W lying under the Ru film or of the film comprised of W compounds can be suppressed, and the conducting failure between the Ru film 230 (lower electrode) and the plug 22 can be prevented. Consequently, the characteristics of the information storage capacitor C can be enhanced, and the characteristics of the memory cells can be improved.

[0115] In addition, the Ru film was exemplified for description in the embodiments 1 and 2. However, an Ir (iridium) film, Pd (palladium) film or Pt (platinum) film and the like can also form hexafluoroacetylacetone and a complex compound (acetylacetonate derivative). Thus, when complex compounds of these, H₂O and H₂ are used as ingredients to form metal films of these as the ratio of partial pressure of H₂O to H₂ is controlled as similar to the embodiments 1 and 2, the same effect can be obtained (see FIG. 21). Graphs (d) and (e) shown in FIG. 21 depict logarithms of equilibrium constant k in terms of reaction temperatures in which a system 1 (IrO₂+H₂) and a system 2 (Ir+H₂O) are in equilibrium, and logarithms of equilibrium constant k in terms of reaction temperatures in which a system 1 (PdO+H₂) and a system 2 (Pd+H₂O) are in equilibrium, respectively. Particularly, Ru or Ir tends to obtain the complex compounds described above, which is preferable for use as the lower electrode.

[0116] Embodiment 3

[0117] In the embodiments 1 and 2, the ratio of partial pressure of H₂O to H₂ was controlled while depositing the Ru film. However, the ratio of partial pressure of H₂O to H₂ may be controlled to form the tantalum oxide film (Ta₂O₅) to be the capacitor dielectric as described below.

[0118] Hereafter, a method for manufacturing a DRAM of this embodiment will be described. Additionally, the steps of forming the lower electrode 30A are the same as the case of the embodiment 1 that has been described with reference to FIGS. 1 to 15, and thus the description will be omitted. Furthermore, the Ru film 30 configuring the lower electrode 30A may be formed according to the method described in the embodiment 2.

[0119] Inside of the hole 27 and the silicon oxide film 24 where the lower electrode 30A has been formed, a tantalum oxide film 332 having a film thickness of about 10 nm to be the capacitor dielectric is deposited, as shown in FIG. 22. The tantalum oxide film 332 is deposited by CVD using pentaethoxytantalum (Ta(OC₂H₅)₅) and H₂O as ingredients.

[0120] In this manner, according to the embodiment, pentaethoxytantalum (Ta(OC₂H₅)₅) and H₂O were used to form the tantalum oxide film 332, and thus the tantalum oxide film 332 having an excellent film quality can be formed.

[0121] More specifically, as described in the embodiment 1, the tantalum oxide film 332 may be deposited by CVD using pentaethoxytantalum (Ta(OC₂H₅)₅) and oxygen as ingredients, but in this case, carbon or compounds thereof are taken into the tantalum oxide film 332 to cause the film quality of the tantalum oxide film to be degraded. Furthermore, oxygen is used as a ingredient, and therefore it might oxidize the lower electrode 30A (Ru film) lying under the tantalum oxide film 332, WN film 29 serving as an adhesive layer or barrier layer 23. When these films are oxidized, the conducting failure between the Ru film 30 (lower electrode) and the plug 22 is generated. Particularly, the conducting failure tends to occur when the diameter of the plug is small.

[0122] Contrary to this, according to the embodiment, the hydrolysis of pentaethoxytantalum (Ta(OC₂H₅)₅) was utilized to generate the tantalum oxide film 332. Therefore, by-products taken into the tantalum oxide film 332, such as carbon or compounds thereof can be reduced, and the tantalum oxide film 332 having an excellent film quality can be formed. Moreover, oxygen is not used as a ingredient. Thus, the underlayer of the tantalum oxide film 332 can be prevented from oxidizing, and the conducting failure between the plug 22 and the lower electrode (Ru film) 30A can be prevented.

[0123] Additionally, the tantalum oxide film 332 may be formed by using pentaethoxytantalum (Ta(OC₂H₅)₅), H₂O and H₂ under the following condition.

[0124] More specifically, the reaction is generated as the ratio of partial pressure of H₂O to H₂ is controlled to be in the area enclosed by graphs (a) and (c) shown in FIG. 23.

[0125] The graph (c) shown in FIG. 23 depicts logarithms of equilibrium constant k in terms of reaction temperatures in which a system 1 (Ta₂O₅+H₂) and a system 2 (Ta+H₂O) are in equilibrium. As described in the embodiment 1, it is expressed by logk log[[H₂O]eq/[H₂]eq], where [H₂O]eq is a partial pressure of H₂O in equilibrium, [H₂]eq is a partial pressure of H₂ in equilibrium, and this equilibrium constant k is determined by the difference (ΔG) of the Gibbs free energy between the system 1 and the system 2.

[0126] Accordingly, under a condition of being in the area below the graph (c), a balance is moved into oxidizing Ta₂O₅, and thus the ratio of partial pressure of H₂O to H₂ needs to be controlled so as to be in the area above the graph (c) shown in FIG. 23 for depositing the tantalum oxide film 332. Here, as described in the embodiment 1, when the ratio of partial pressure of H₂O to H₂ is controlled so as to be in the area below the graph (a) shown in FIG. 23, the oxidation of Ru can be suppressed. However, the deposition of the tantalum oxide film needs a ingredient solution to vaporize, and the decomposition of the ingredient can occur when processed at high temperatures. Therefore, it is considered that the reaction temperatures are preferably about 100 to 200° C. (a boiling point or above of the ingredient solution) to 500° C.

[0127] In this manner, according to the embodiment, the reaction was generated in which pentaethoxytantalum (Ta(OC₂H₅)₅), H₂O and H₂ are used and the ratio of partial pressure of H₂O to H₂ is controlled so as to be in the area enclosed by the graphs (a) and (c) shown in FIG. 23. Thus, the tantalum oxide film 332 can be deposited as the Ru film is prevented from oxidizing.

[0128] Furthermore, when the reaction is generated as the ratio of partial pressure of H₂O to H₂ is controlled so as to be in the area enclosed by graphs (b) and (c) shown in FIG. 24, the tantalum oxide film 332 can be deposited as the Ru film or WN film is prevented from oxidizing as described in the embodiment 2.

[0129] Then, annealing is performed in an Ar (argon) atmosphere at a temperature of 650° C. to crystallize the tantalum oxide film 332.

[0130] After that, the upper electrode 33 is formed above the tantalum oxide film 332 as similar to the embodiment 1 (see FIG. 16).

[0131] As described above in detail, according to the embodiment, the reaction was generated in which pentaethoxytantalum (Ta(OC₂H₅)₅), H₂O and H₂ are used and the ratio of partial pressure of H₂O to H₂ is further controlled. Therefore, the tantalum oxide film 332 can be deposited as the film (Ru film or WN film) under the tantalum oxide film 332 is prevented from oxidizing.

[0132] Accordingly, the conducting failure between the Ru film 30 (lower electrode) and the plug 22 can be prevented. Consequently, the characteristics of the information storage capacitor C can be enhanced, and the characteristics of the memory cells can be improved.

[0133] Additionally, in the embodiment, the tantalum oxide film was used as the capacitor dielectric, but Al₂O₃ or BST(Ba_(x)Sr_(1 x)TiO₃) may be used.

[0134] When Al(CH₃)₂H (dimethylaluminumhydride), H₂O and H₂ are used as ingredients to form an Al₂O₃ film as the ratio of partial pressure of H₂O to H₂ is controlled as in the embodiment, the same effect can be obtained.

[0135] Furthermore, a BST film can be formed by using Ba(C(CH₃)₃—CO—CH—CO—C(CH₃)₃)₂bis (dipivaloylmetanate)barium, Sr(C(CH₃)₃—CO—CH—CO—C(CH₃)₃)₂bis (dipivaloylmetanate)strontiu m, or TiO(C(CH₃)₃—CO—CH—CO—C(CH₃)₃)₂titanylbis(dipivaloylmetanate), H₂O and H₂ as ingredients. Also in this case, when the BST film is formed as the ratio of partial pressure of H₂O to H₂ is controlled as in the embodiment, the same effect can be obtaine

[0136] Moreover, in the embodiments 1 to 3, the memory cells of the DRAM were exemplified for description, but the invention can widely be adapted to semiconductor integrated circuit devices having a MIM (Metal Insulator Metal) capacitor and not limited to the DRAM.

[0137] Embodiment 4

[0138] In the embodiments 1 to 3, the invention was adapted to the part of information storage capacitor of the DRAM, but the invention may be adapted to the part of interconnect lines. Next, a method of manufacturing a semiconductor integrated circuit device of this embodiment of the invention will be described. FIGS. 25 to 28 and FIGS. 32 to 35 are feature sections of a substrate illustrating the method of the semiconductor integrated circuit device of the embodiment of the invention.

[0139] First, as shown in FIG. 25, an n-channel MISFET Qn and a p-channel MISFET Qp are formed according to general steps of forming MISFETs.

[0140] For example, the general steps of forming MISFETs are as follows.

[0141] First, a semiconductor substrate 401 comprised of p-type monocrystalline silicon is etched to form a device isolating trench 402, and the substrate 401 is thermally oxidized to form a thin silicon oxide film on the inner walls of the trench. Then, a silicon oxide film 407 is deposited above the substrate 401 including the inside of the trench by CVD, and the silicon oxide film 407 above the trench is polished by CMP to planarize the surface.

[0142] Subsequently, a p-type impurity and an n-type impurity are ion-implanted into the substrate 401, the impurities are diffused by annealing to form a p-well 403 and an n-well 404, and then a clean gate oxide film 408 having a film thickness of about 6 nm is formed over each of the surfaces of the p-well 403 and the n-well 404.

[0143] After that, a low-resistant polycrystalline silicon film 409 a doped with phosphorous is deposited above the gate oxide film 408 by CVD, a thin WN film (not shown) and a W film 409 b are deposited thereabove by sputtering, and then a silicon nitride film 410 is further deposited thereabove by CVD.

[0144] Subsequently, the silicon nitride film 410 is dry-etched to leave the silicon nitride film 410 in the area to form a gate electrode, and the silicon nitride film 410 is used as a mask to dry-etch the W film 409 b and the WN film (not shown), whereby a gate electrode 409 comprised of the polycrystalline silicon film 409 a, the WN film and the W film 409 b is formed.

[0145] Then, an n-type impurity is ion-implanted into the p-well 403 on both sides of the gate electrode 409 to form n semiconductor regions 411, and a p-type impurity is ion-implanted into the n-well 404 to form p semiconductor regions 412.

[0146] Subsequently, a silicon nitride film is deposited above the substrate 401 by CVD for anisotropic etching, whereby a sidewall spacer 413 is formed on the sidewalls of the gate electrode 409.

[0147] After that, an n-type impurity is ion-implanted into the p-well 403 to form n semiconductor regions 414 (source/drain), and a p-type impurity is ion-implanted into the n-well 404 to form p semiconductor regions 415 (source/drain).

[0148] By the steps up to now, the n-channel MISFET Qn and the p-channel MISFET Qp having source and drain of the LDD (Lightly Doped Drain) structure are formed.

[0149] After this, an interlayer dielectric such as a silicon oxide film and a conductive film such as a Cu film are alternately deposited above the MISFETs Qn and Qp to form a plurality of interconnect lines, and the formation of the interlayer dielectric and the interconnect lines will be described in detail with reference to FIGS. 26 to 35.

[0150] First, as shown in FIG. 26, a silicon oxide film having a film thickness of about 700 to 800 nm is deposited above the MISFETs Qn and Qp by CVD, and then the silicon oxide film is polished by CMP to planarize the surface to form an interlayer dielectric TH1.

[0151] Subsequently, a photoresist film (not shown) is formed above the interlayer dielectric TH1, the photoresist film is used as a mask to etch the interlayer dielectric TH1, whereby contact holes Cl are formed above the n semiconductor regions 414 and the p semiconductor regions 415 on the front surface of the semiconductor substrate 401.

[0152] Then, as shown in FIG. 27, a tungsten film is deposited above the interlayer dielectric TH1 including the inside of the contact holes Cl by CVD, and the tungsten film is polished by CMP until the interlayer dielectric TH1 is exposed, whereby a plug P1 is formed inside the contact holes Cl. Additionally, a thin TiN film may be deposited before depositing the tungsten film to form the plug 1 into a laminated structure comprised of the tungsten film and a barrier film formed of the TiN film.

[0153] After that, a silicon nitride film H1 a and a silicon oxide film H1 b are sequentially deposited above the interlayer dielectric TH1 and the plugs P1 by CVD to form an interconnecting trench dielectric H1 comprised of these films. The interconnecting trench dielectric H1 in the area where a first interconnect layer is to be formed is etched to form interconnecting trenches HM 1. Furthermore, the silicon nitride film H1 a is used as an etching stopper in the etching described above.

[0154] Then, as shown in FIG. 28, a barrier layer M1 a comprised of tungsten nitride is deposited above the interconnecting trench dielectric H1 included in the inside of the interconnecting trench HM 1 by sputtering. Subsequently, a Cu film M1 b is formed above the barrier layer M1 a by CVD.

[0155] This Cu film M1 b is formed by using Cu(HFAC)₂ which is a compound of Cu (copper), H₂O and H₂as ingredients. In addition, HFAC means (CF₃COCHCOCF₃).

[0156] An organic compound solution of Cu(HFAC)₂ is vaporized to react with H₂O and H₂ for deposition. Furthermore, a tetrahydrofuran solution is named as the organic compound solution. Here, the reaction is generated as the ratio of partial pressure of H₂O to H₂ is controlled so as to be in the area below a graph (a′) shown in FIG. 29.

[0157] The reason for control in this manner is to suppress the oxidation of Cu while depositing the Cu film. The reason why the oxidation of Cu is allowed to be suppressed can also be described as similar to the case of Ru.

[0158] More specifically, FIG. 29 depicts logarithms of equilibrium constant k in terms of reaction temperatures, in which a system 1 (CuO+H₂) and a system 2 (Cu+H₂O) are in equilibrium. It is expressed by logk log[[H₂O]eq/[H₂]eq], where [H₂O]eq is a partial pressure of H₂O, and [H₂]eq is a partial pressure of H₂. Moreover, this equilibrium constant k can be determined by the difference (ΔG) of the Gibbs free energy between the system 1 and the system 2, where ΔG−RTlnk.

[0159] Accordingly, under a condition of being in the area above the graph (a′), a balance is moved into oxidizing Cu. However, when the Cu film is deposited as the ratio of partial pressure of H₂O to H₂ is controlled so as to be in the area below the graph (a′) shown in FIG. 29, the oxidation of Cu can be suppressed.

[0160] However, the solution of Cu(HFAC)₂ to be a ingredient needs to be vaporized in depositing the Cu film, and the decomposition of the ingredient can occur when processed at high temperatures. Thus, it is considered that the reaction temperatures are preferably from 100 to 200° C. (a boiling point or above of the ingredient solution) to 500° C.

[0161] In this manner, according to the embodiment, the reaction was generated in which Cu(HFAC)₂, H₂O and H₂ are used and the ratio of partial pressure of H₂O to H₂ is controlled to be in the area below the graph (a′) shown in FIG. 29. Therefore, the Cu film is prevented from oxidizing, and the Cu film having a smaller content of oxygen, carbon or a compound of these can be formed.

[0162] Additionally, when the reaction is generated as the ratio of partial pressure of H₂O and H₂ is controlled to be in the area below a graph (b) shown in FIG. 30 in depositing this Cu film M1 b, the oxidation of Cu or W in the barrier layer M1 a comprised of tungsten nitride can be suppressed in deposition.

[0163] The graph (b) shown in FIG. 30 depicts logarithms of equilibrium constant k in terms of reaction temperatures, in which a system 1 (WO₂+H₂) and a system 2 (W+H₂O) are in equilibrium. As described above, it is expressed by logk log[[H₂O]eq/[H₂]eq], where [H₂O]eq is a partial pressure of H₂O in equilibrium, [H₂]eq is a partial pressure of H₂ in equilibrium, and this equilibrium constant k is determined by the difference (ΔG) of the Gibbs free energy between the system 1 and the system 2.

[0164] Thus, in a condition of being in the area above the graph (b), a balance is moved into oxidizing W. However, when the Cu film is deposited as the ratio of partial pressure of H₂O to H₂ is controlled to be in the area below the graph (b) shown in FIG. 30, the oxidation of Cu is suppressed and the oxidation of W can also be suppressed.

[0165] Accordingly, the oxidation of Cu or W in the barrier layer M1 a comprised of tungsten nitride can be suppressed in deposition. Consequently, the conducting failure between the Cu film M1 b and the plug P1 can be prevented. Furthermore, the oxidation of W in the barrier layer M1 a is suppressed, whereby the barrier property can be prevented from dropping. Accordingly, a short circuit between interconnect lines can be avoided due to the Cu diffusion into the dielectric.

[0166] This Cu film M1 b may be formed by using Cu(HFAC)(TMVS) that is a compound of Cu cations, hexafluoroacetylacetone (CF₃COCHCOCF₃)⁻ and trimethylvinylsilane (CH₂CHSi(CH₃)₃), H₂O, and H₂ as ingredients. Moreover, HFAC means (CF₃COCHCOCF₃)⁻, and TMVS means (CH₂ CHSi(CH₃)₃).

[0167] An organic compound solution of Cu(HFAC)(TMVS) is vaporized to react with H₂O and H₂ for deposition. Besides, as the organic compound solution, a tetrahydrofuran solution is named. FIG. 31 depicts the reaction of depositing the Cu film. Also in this reaction, H₂O serves like a catalyst, which H₂O is added to increase a reaction rate.

[0168] Also in this reaction, when the ratio of partial pressure of H₂O to H₂ is controlled to be in the area below the graph (a′) shown in FIG. 29, the oxidation of Cu can be suppressed as described above. Additionally, when the ratio of partial pressure of H₂O to H₂ is controlled to be in the area below the graph (b) shown in FIG. 30, the oxidation of Cu can be suppressed and the oxidation of W can also be suppressed. Consequently, the conducting failure between the Cu film M1 b and the plug P1 or a short circuit between interconnect lines can be prevented.

[0169] Then, as shown in FIG. 32, the Cu film M1 b and the barrier layer M1 a outside the interconnecting trench HM1 are removed by CMP, whereby a first interconnect layer M1 comprised of the Cu film M1 b and the barrier layer M1 a is formed.

[0170] Subsequently, as shown in FIG. 33, a silicon nitride film is deposited above the first interconnect layer M1 by CVD to form a copper diffusion preventing dielectric D1, and then an interlayer dielectric TH2 is formed. The interlayer dielectric TH2 is formed as similar to the interlayer dielectric TH1.

[0171] After that, a resist film (not shown) having areas for contacts in the first interconnect layer M1 opened is formed over the interlayer dielectric TH2, and it is used as a mask to anisotropically etch the interlayer dielectric TH2 and the copper diffusion preventing dielectric D1 until the surface of the first interconnect layer M1 is exposed.

[0172] Then, as shown in FIG. 34, a nitride of a high melting point metal such as TiN is deposited in a thickness of about 30 to 70 nm above the interlayer dielectric TH2 including the inside of the contact holes C2 to form a barrier layer P2 a. Subsequently, a tungsten film P2 b having a film thickness of about 200 to 500 nm above the barrier layer P2 a by CVD. Additionally, the tungsten film P2 b is formed so as to fully bury the inside of the contact holes C2.

[0173] After that, the tungsten film P2 b and the barrier layer P2 a outside the contact holes C2 are removed by CMP, whereby a plug P2 comprised of the tungsten film P2 b and the barrier layer P2 a is formed.

[0174] Then, as shown in FIG. 35, a second interconnect layer M2 is formed above the plug P2 as similar to the first interconnect layer M1. More specifically, a silicon nitride film H2 a and a silicon oxide film H2 b are sequentially deposited above the interlayer dielectric TH2 and the plug P2, and an interconnecting trench dielectric H2 comprised of these films is etched, whereby an interconnecting trench HM2 is formed. Subsequently, a barrier layer M2 a comprised of titanium nitride is deposited above the interconnecting trench dielectric H2 including the inside of the interconnecting trench HM2, and then a Cu film M2 b is formed above the barrier layer M2 a by CVD under the condition described above. After that, the Cu film M2 b and the barrier layer M2 a outside the interconnecting trench HM2 are removed by CMP, whereby a second interconnect layer M2 comprised of the Cu film M2 b and the barrier layer M2 a is formed.

[0175] Then, a copper diffusion preventing dielectric D2 and an interlayer dielectric TH3 are formed above the second interconnect layer M2. These films are formed as similar to the copper diffusion preventing dielectric D1 and the interlayer dielectric TH1. After that, a contact hole C3 is formed inside the copper diffusion preventing dielectric D2 and the interlayer dielectric TH3, and a plug P3 is formed inside the contact hole C3. This plug P3 is formed as similar to the plug P2. Subsequently, an interconnecting trench dielectric H3 and an interconnecting trench HM 3 are formed over the interlayer dielectric TH3 and the plug P3 as similar to the interconnecting trench dielectric H1 and the interconnecting trench HM 1. A third interconnect layer M3 is formed as similar to the first interconnect layer M1.

[0176] The formation of copper diffusion preventing dielectrics (D3, D4 and D5) and interlayer dielectrics (TH4 and TH5) over these interconnect lines, the formation of plugs (P4 and P5) formed inside contact holes in these films and the formation of interconnect lines (M4 and M5) above the plugs are repeated, whereby a semiconductor integrated circuit device having a multilevel interconnection structure can be formed.

[0177] Subsequently, a passivation film 420 comprised of a silicon nitride film and a silicon oxide film is formed above the fifth interconnect layer M5, and a part of the passivation film 420 is removed by etching, whereby a bonding pad part above the fifth interconnect layer M5 is exposed (not shown). Then, an underlayer bump electrode comprised of gold is formed over the exposed fifth interconnect layer M5 to form a bump electrode comprised of gold or solder above the underlayer bump electrode (not shown).

[0178] After that, the semiconductor integrated circuit device is packaged on a package substrate for completion, but the description for these will be omitted.

[0179] In addition, the interconnect lines of five layers were formed in the embodiment, but interconnect lines under or above five layers may be formed. Furthermore, the MISFITs Qn and Qp were formed as semiconductor devices in the embodiment, but other devices such as bipolar transistors may be formed, not limited to these MISFETs. Moreover, the embodiment can widely be adapted to semiconductor integrated circuit devices having metal interconnect lines formed by CVD.

[0180] Embodiment 5

[0181] In the embodiment 1, the ratio of partial pressure of H₂O to H₂ was controlled in depositing the Ru film, but alcohol may be used in depositing this film instead of H₂.

[0182] Hereafter, a method of manufacturing a DRAM in this embodiment will be described, but it is the same as the case of the embodiment 1 other than the use of alcohol as a reducing agent instead of H₂ in depositing the Ru film. Thus, only the steps of depositing the Ru film will be described.

[0183] For example, a Ru film (not shown) having a film thickness of about 15 nm is formed above the WN film 29 shown in FIG. 11 described in the embodiment 1 by sputtering, and then the Ru film 30 having a film thickness of about 30 nm by CVD (see FIG. 12).

[0184] Here, the Ru film 30 is formed by using Ru(HFAC)₃, H₂O and alcohol as ingredients. As for alcohol in this case, secondary alcohol or under can be used, such as methanol, ethanol or isopropyl alcohol.

[0185] First, the reaction mechanism of depositing the Ru film will be described. Ru(HFAC)₃ first reacts with H₂O (it is decomposed by H₂O) to be a Ru(OH)₃ hydroxide. Then, this Ru(OH)₃ hydroxide is reduced by alcohol (R—OH) to generate Ru. At this time, alcohol is oxidized to be aldehyde or ketone.

[0186]FIG. 36 depicts the reaction mechanism when using isopropyl alcohol. Additionally, Ru(DPM)₃ may be used instead of Ru(HFAC)₃(FIG. 37). Here, DPM means ((CH₃)₃CCOCHCOC(CH₃)₃)⁻. Such reaction is an exothermic reaction of about 68 kJ under atmospheric pressure at ordinary temperature, which proceeds easily.

[0187] In this manner, according to the embodiment, Ru(HEAC)₃, H₂O and alcohol were used in hydrolysis to form the Ru film. Thus, the Ru film having an excellent film quality can be formed as described in the embodiment 1.

[0188] Additionally, alcohol is easily handled as compared with H₂; the Ru film can be formed easily.

[0189] Furthermore, the Ru film was exemplified for description in the embodiment. However, when an Ir compound, H₂O and alcohol are used as ingredients to form an Ir film, the same effect can be obtained.

[0190] Moreover, when the Cu film configuring the interconnect lines described in the embodiment 4 is formed by using a Cu compound, H₂O and alcohol as ingredients, the same effect can be obtained. A method of manufacturing a semiconductor integrated circuit device having the Cu film in the interconnect line part is the same as the case of the embodiment 4 other than the use of alcohol as a reducing agent instead of H₂, and thus the description will be omitted.

[0191] As described above, the invention made by the inventor has been described specifically, but it is needless to say that the invention is not limited to the embodiments, which can be modified variously without deviating the scope of the teachings.

[0192] The brief description of the effect obtained by the representative inventions among the inventions disclosed in the application is as follows.

[0193] The film quality of a metal film formed by CVD can be enhanced, such as the Ru film configuring the lower electrode of the information storage capacitor or Cu film configuring interconnect lines.

[0194] Additionally, the film quality of a meal oxide film formed by CVD can be enhanced, such as the tantalum oxide film configuring the capacitive dielectric of the information storage capacitor.

[0195] Furthermore, the oxidation of a metal film or metal oxide film under the metal film or metal oxide film formed by CVD can be suppressed, and the conducting failure can be reduced.

[0196] Consequently, the characteristics of the semiconductor integrated circuit devices can be improved. 

What is claimed is:
 1. A method of manufacturing a semiconductor integrated circuit device comprising the steps of: (a) forming memory cell selecting MISFETs over a main surface of a semiconductor substrate; and (b) forming a Ru (ruthenium) film by chemical vapor deposition using a compound of Ru, H₂O and a reducing agent, wherein the Ru film comprises a lower electrode of a capacitor electrically connected to source/drain regions of the memory cell selecting MISFETs.
 2. The method of manufacturing the semiconductor integrated circuit device according to claim 1, wherein the reducing agent is H₂ or alcohol.
 3. The method of manufacturing the semiconductor integrated circuit device according to claim 1, wherein the compound of Ru is an acetylacetone derivative compound of Ru.
 4. The method of manufacturing the semiconductor integrated circuit device according to claim 1 further comprising the steps of: (c) forming a capacitor dielectric over the Ru film; and (d) forming an upper electrode over the capacitor dielectric.
 5. A method of manufacturing a semiconductor integrated circuit device comprising the steps of: (a) forming memory cell selecting MISFETs over a main surface of a semiconductor substrate; and (b) forming a Ru (ruthenium) film by chemical vapor deposition using a compound of Ru, H₂O and H₂ at a predetermined temperature, wherein the Ru film comprises a lower electrode of a capacitor electrically connected to source/drain regions of the memory cell selecting MISFETS, wherein the Ru film is formed under a condition that a ratio of partial pressure of the H₂O to the H₂ ([H₂O]/[H₂]) at the temperature becomes smaller than a ratio of partial pressure of H₂O to H₂ ([H₂O]eq/[H₂]eq) when a system 1 (RuO₂+H₂) and a system 2 (Ru+H₂O) are in equilibrium at the temperature.
 6. The method of manufacturing the semiconductor integrated circuit device according to claim 5, wherein the predetermined temperature is from 100 to 500° C.
 7. A method of manufacturing a semiconductor integrated circuit device comprising the steps of: (a) forming memory cell selecting MISFETs over a main surface of a semiconductor substrate; (b) forming a plug electrically connected to source/drain regions of the memory cell selecting MISFETs; (c) forming a silicon oxide film over the plug; (d) forming a hole in the silicon oxide film, the hole reaching a surface of the plug; (e) forming a metal layer or metal nitride layer having conductivity over sidewalls and a bottom surface of the hole; and (f) forming a Ru film over the metal layer or metal nitride layer by chemical vapor deposition using a compound of Ru, H₂O and a reducing agent, wherein the Ru film comprises a lower electrode of a capacitor.
 8. The method of manufacturing the semiconductor integrated circuit device according to claim 7, wherein the reducing agent is H₂ or alcohol.
 9. The method of manufacturing the semiconductor integrated circuit device according to claim 7 further comprising the steps of: (g) forming a capacitor dielectric over the Ru film; and (h) forming an upper electrode over the capacitor dielectric.
 10. The method of manufacturing the semiconductor integrated circuit device according to claim 7, wherein the metal layer or metal nitride layer is a tungsten layer or tungsten nitride layer.
 11. The method of manufacturing the semiconductor integrated circuit device according to claim 7, wherein the metal nitride layer is a tantalum nitride layer.
 12. The method of manufacturing the semiconductor integrated circuit device according to claim 7, wherein the compound of Ru is an acetylacetone derivative compound of Ru.
 13. A method of manufacturing a semiconductor integrated circuit device comprising the steps of: (a) forming memory cell selecting MISFETs over a main surface of a semiconductor substrate; (b) forming a plug electrically connected to source/drain regions of the memory cell selecting MISFETs; (c) forming a silicon oxide film over the plug; (d) forming a hole in the silicon oxide film, the hole reaching a surface of the plug; (e) forming a metal layer or metal nitride layer having conductivity over sidewalls and a bottom surface of the hole; and (f) forming a Ru film over the metal layer or metal nitride layer by chemical vapor deposition using a compound of Ru, H₂O and a reducing agent at a predetermined temperature, wherein the Ru film comprises a lower electrode of a capacitor, wherein the Ru film is formed under a condition that a ratio of partial pressure of the H₂O to the H₂ ([H₂O]/[H₂])becomes smaller than a ratio of partial pressure of H₂O to H₂ ([H₂O]eq/[H₂]eq) when a system 1 (an oxide of metal forming the metal layer or metal nitride layer+H₂) and a system 2 (a metal forming the metal layer or metal nitride layer+H₂O) are in equilibrium at the temperature.
 14. A method of manufacturing a semiconductor integrated circuit device comprising the steps of: (a) forming memory cell selecting MISFETs over a main surface of a semiconductor substrate; and (b) forming an Ir (iridium) film, Pd (palladium) film or Pt (platinum) film by chemical vapor deposition using a compound of these, H₂O and a reducing agent, the Ir film, wherein Pd film or Pt film comprises a lower electrode of a capacitor electrically connected to source/drain regions of the memory cell selecting MISFETs.
 15. The method of manufacturing the semiconductor integrated circuit device according to claim 14, wherein the reducing agent is H₂ or alcohol.
 16. The method of manufacturing the semiconductor integrated circuit device according to claim 14 further comprising the steps of: (c) forming a capacitive dielectric over the Ir film, Pd film or Pt film; and (d) forming an upper electrode over the capacitive dielectric.
 17. A method of manufacturing a semiconductor integrated circuit device comprising the steps of: (a) forming memory cell selecting MISFETs over a main surface of a semiconductor substrate; and (b) forming an Ir (iridium) film, Pd (palladium) film or Pt (platinum) film by chemical vapor deposition using a compound of these, H₂O and H₂ at a predetermined temperature, the Ir film, wherein Pd film or Pt film comprises a lower electrode of a capacitor electrically connected to source/drain regions of the memory cell selecting MISFETs, wherein the Ir film, Pd film or Pt film are formed under a condition that a ratio of partial pressure of the H₂O to the H₂ ([H₂O]/[H₂]) at the temperature becomes smaller than a ratio of partial pressure of H₂O to H₂ ([H₂O]eq/[H₂]eq) when a system 1 (an oxide of the Ir film, Pd film or Pt film+H₂) and a system 2 (the Ir film, Pd film or Pt film+H₂O) are in equilibrium at the temperature.
 18. A method of manufacturing a semiconductor integrated circuit device comprising the steps of: (a) forming memory cell selecting MISFETs over a main surface of a semiconductor substrate; (b) forming a metal film configuring a lower electrode of a capacitor electrically connected to source/drain regions of the memory cell selecting MISFETs; and (c) forming a metal oxide over the metal film at a predetermined temperature, wherein the metal oxide comprises a capacitor dielectric of a capacitor, wherein the metal oxide is formed by chemical vapor deposition using a compound of metal forming the metal oxide, H₂O and a reducing agent.
 19. The method of manufacturing the semiconductor integrated circuit device according to claim 18, wherein the reducing agent is H₂ or alcohol.
 20. The method of manufacturing the semiconductor integrated circuit device according to claim 18 further comprising the step of: (d) forming an upper electrode over the capacitor dielectric.
 21. The method of manufacturing the semiconductor integrated circuit device according to claim 18, wherein the metal oxide is tantalum oxide, and the compound of metal is pentaethoxytantalum (Ta(OC₂H₅)₅).
 22. The method of manufacturing the semiconductor integrated circuit device according to claim 18, wherein the metal film is a Ru film.
 23. The method of manufacturing the semiconductor integrated circuit device according to claim 18, wherein the metal oxide is Al₂O₃ or BST(Ba_(x)Sr_(1 x)TiO₃).
 24. A method of manufacturing a semiconductor integrated circuit device comprising the steps of: (a) forming memory cell selecting MISFETs over a main surface of a semiconductor substrate; (b) forming a metal film configuring a lower electrode of a capacitor electrically connected to source/drain regions of the memory cell selecting MISFETS; (c) forming a metal oxide over the metal film at a predetermined temperature, wherein the metal oxide comprises a capacitor dielectric of a capacitor, wherein the metal oxide is formed by chemical vapor deposition using a compound of metal forming the metal oxide, H₂O and a reducing agent, and the metal oxide is formed under a condition that a ratio of partial pressure of the H₂O to the H₂ ([H₂O]/[H₂]) becomes greater than a ratio of partial pressure of H₂O to H₂ ([H₂O]eq₁/[H₂]eq₁) when a system 1 (the metal oxide+H₂) and a system 2 (a metal forming the metal oxide+H₂O) are in equilibrium at the temperature and becomes smaller than a ratio of partial pressure of H₂O to H₂ ([H₂O]eq₂/[H₂]eq₂) when a system 3 (an oxide of metal forming the metal film+H₂) and a system 4 (a metal forming the metal film+H₂O) are in equilibrium at the temperature; and (d) forming an upper electrode of the capacitor over the capacitor dielectric.
 25. The method of manufacturing the semiconductor integrated circuit device according to claim 24, wherein the predetermined temperature is from 100 to 500° C.
 26. A method of manufacturing a semiconductor integrated circuit device comprising the steps of: (a) forming an interlayer dielectric over a semiconductor substrate; and (b) forming a Cu film configuring interconnect lines by chemical vapor deposition using a compound of Cu, H₂O and a reducing agent.
 27. The method of manufacturing the semiconductor integrated circuit device according to claim 26, wherein the reducing agent is H₂ or alcohol.
 28. The method of manufacturing the semiconductor integrated circuit device according to claim 26, wherein the compound of Cu is Cu(CF₃—CO—CH—CO—CF₃)₂.
 29. The method of manufacturing the semiconductor integrated circuit device according to claim 26, wherein the compound of Cu is Cu(CF₃—CO—CH—CO—CF₃)(CH₂ CHSi(CH₃)₃).
 30. A method of manufacturing a semiconductor integrated circuit device comprising the steps of: (a) forming an interlayer dielectric over a semiconductor substrate; and (b) forming a Cu film configuring interconnect lines over the interlayer dielectric by chemical vapor deposition using a compound of Cu, H₂O and H₂ at a predetermined temperature, wherein the Cu film is formed under a condition that a ratio of partial pressure of the H₂O to the H₂ ([H₂O]/[H₂]) becomes smaller than a ratio of partial pressure of H₂O to H₂ ([H₂O]eq/[H₂]eq) when a system 1 (CuO₂+H₂) and a system 2 (Cu+H₂O) are in equilibrium at the temperature.
 31. The method of manufacturing the semiconductor integrated circuit device according to claim 30, wherein the predetermined temperature is from 100 to 500° C.
 32. A method of manufacturing a semiconductor integrated circuit device comprising the steps of: (a) forming an interlayer dielectric over a semiconductor substrate; (b) forming a metal layer or metal nitride layer having conductivity over the interlayer dielectric; and (c) forming a Cu film configuring interconnect lines over the metal layer or metal nitride layer by chemical vapor deposition using a compound of Cu, H₂O and a reducing agent at a predetermined temperature.
 33. The method of manufacturing the semiconductor integrated circuit device according to claim 32, wherein the reducing agent is H₂ or alcohol.
 34. The method of manufacturing the semiconductor integrated circuit device according to claim 32, wherein the metal layer or metal nitride layer is a tungsten layer or tungsten nitride layer.
 35. The method of manufacturing the semiconductor integrated circuit device according to claim 32, wherein the compound of Cu is Cu(CF₃—CO—CH—CO—CF₃)₂.
 36. The method of manufacturing the semiconductor integrated circuit device according to claim 32, wherein the compound of Cu is Cu(CF₃—CO—CH—CO—CF₃)(CH₂ CHSi(CH₃)₃).
 37. A method of manufacturing a semiconductor integrated circuit device comprising the steps of: (a) forming an interlayer dielectric over a semiconductor substrate; (b) forming a metal layer or metal nitride layer having conductivity over the interlayer dielectric; and (c) forming a Cu film configuring interconnect lines over the metal layer or metal nitride layer by chemical vapor deposition using a compound of Cu, H₂O and H₂ at a predetermined temperature, wherein the Cu film is formed under a condition that a ratio of partial pressure of the H₂O to the H₂ ([H₂O]/[H₂]) becomes smaller than a ratio of partial pressure of H₂O to H₂ ([H₂O]eq/[H₂]eq) when a system 1 (an oxide of metal forming the metal layer or metal nitride layer+H₂) and a system 2 (a metal forming the metal layer or metal nitride layer+H₂O) are in equilibrium at the temperature.
 38. The method of manufacturing the semiconductor integrated circuit device according to claim 37, wherein the predetermined temperature is from 100 to 500° C.
 39. A method of manufacturing a semiconductor integrated circuit device having a metal film over a semiconductor substrate, the method comprising: forming the metal film by chemical vapor deposition using a compound of metal forming the metal film, H₂O and H₂.
 40. A method of manufacturing a semiconductor integrated circuit device having a metal oxide film over a semiconductor substrate, the method comprising: forming the metal oxide film by chemical vapor deposition using a compound of metal forming the metal oxide film, H₂O and H₂.
 41. A method of manufacturing a semiconductor integrated circuit device having a metal film over a semiconductor substrate, the method comprising: forming the metal film by chemical vapor deposition using a compound of metal forming the metal film, H₂O and H₂ at a predetermined temperature, wherein the metal film is formed under a condition that a ratio of partial pressure of the H₂O to the H₂ ([H₂O]/[H₂]) becomes smaller than a ratio of partial pressure of H₂O to H₂ ([H₂O]eq/[H₂]eq) when a system 1 (an oxide of metal forming the metal film+H₂) and a system 2 (a metal forming the metal film+H₂O) are in equilibrium at the temperature.
 42. A method of manufacturing a semiconductor integrated circuit device having a metal oxide film over a semiconductor substrate, the method comprising: forming the metal oxide film by chemical vapor deposition using a compound of metal forming the metal oxide film, H₂O and H₂ at a predetermined temperature, wherein the metal oxide film is formed under a condition that a ratio of partial pressure of the H₂O to the H₂ ([H₂O]/[H₂]) becomes greater than a ratio of partial pressure of H₂O to H₂ ([H₂O]eq/[H₂]eq) when a system 1 (an oxide of metal forming the metal oxide film+H₂) and a system 2 (a metal forming the metal oxide film+H₂O) are in equilibrium at the temperature.
 43. A method of manufacturing a semiconductor integrated circuit device having a second metal film over a first metal film or first metal nitride film overlaying a semiconductor substrate, the method comprising: forming the second metal film by chemical vapor deposition using a compound of metal forming the second metal film, H₂O and H₂ at a predetermined temperature, wherein the second metal film is formed under a condition that a ratio of partial pressure of the H₂O to the H₂ ([H₂O]/[H₂]) becomes smaller than a ratio of partial pressure of H₂O to H₂ ([H₂O]eq/[H₂]eq) when a system 1 (an oxide of metal forming the first metal film or first metal nitride film+H₂) and a system 2 (a metal forming the first metal film or first metal nitride film+H₂O) are in equilibrium at the temperature.
 44. A method of manufacturing a semiconductor integrated circuit device having a second metal oxide film over a first metal film or first metal nitride film overlaying a semiconductor substrate, the method comprising: forming the second metal oxide film by chemical vapor deposition using a compound of metal forming the second metal oxide film, H₂O and H₂ at a predetermined temperature, wherein the second metal oxide film is formed under a condition that a ratio of partial pressure of the H₂O to the H₂ ([H₂O]/[H₂])becomes greater than a ratio of partial pressure of H₂O to H₂ ([H₂O]eq₁/[H₂]eq₁) when a system 1 (an oxide of metal forming the second metal oxide film+H₂) and a system 2 (a metal forming the second metal oxide film+H₂O) are in equilibrium at the temperature and becomes smaller than a ratio of partial pressure of H₂O to H₂ ([H₂O]eq₂/[H₂]eq₂) when a system 3 (an oxide of metal forming the first metal film or first metal nitride film+H₂) and a system 4 (a metal forming the first metal film or first metal nitride film+H₂O) are in equilibrium at the temperature. 